Snapdragon 8 Gen 3 Benchmarks Show New Chip Beats iPhone 15 Pro Max in Geekbench Multi-Core Test

Snapdragon 8 Gen 3 was launched by Qualcomm earlier this week as the company’s newest flagship mobile processor. We can expect the new chipset to feature on flagship smartphones that will debut in the coming weeks and months — starting with the Xiaomi 14 that will be launched in China on Thursday. According to Qualcomm, the new octa-core chip will offer a 30 percent increase in performance and a 20 percent improvement in power efficiency over its predecessor, the Snapdragon 8 Gen 2. Now, benchmarks of the new Snapdragon 8 Gen 3 have been published by the chipmaker, giving us an idea of how it fares against existing smartphones.

Qualcomm’s new Snapdragon 8 Gen 3 is an octa-core mobile processor comprising an Arm Cortex-X4 Prime core at a peak clock speed of 3.3GHz, three Cortex-A720 performance cores at 3.2GHz and two Cortex-A720 cores at 3GHz, along with two Cortex-A520 efficiency cores at 2.3GHz. It is a 4nm processor, unlike Apple’s latest A17 Bionic chip that is fabricated using TSMC’s 3nm process technology.

The chipmaker revealed on Thursday that the Snapdragon 8 Gen 3 scores between 2,320 and 2,229 points on the Geekbench 6 single-core benchmark test. This figure is higher than the score of nearly every other Android smartphone currently available, including the Samsung Galaxy S23 Ultra, OnePlus 11, and Google Pixel 8 Pro. However, Qualcomm’s new chip lags behind the iPhone 15 Plus and iPhone 15 Pro Max, that score around 2,600 and 2,900 points, respectively.

However, in the multi-core Geekbench 6 benchmark test, the Snapdragon 8 Gen 3 scores between 7,439 and 7,526 points. This places the new smartphone chip ahead of the iPhone 15 Pro Max, which has lower scores (around 7,200 points) and iPhone 15 Plus (around 6,400 points). Other handsets powered by last year’s Snapdragon 8 Gen 2 chip score have even lower multi-core benchmark scores, well under the 6,000-point mark.

In the AnTuTu benchmark test, the Snapdragon 8 Gen 3 scored between 2.13 million and 2.14 million points — this score is higher than every single smartphone released by smartphone makers with the Snapdragon Gen 2 chipset — including the iQoo 11 (16 million points), Samsung Galaxy S23 Ultra (15.2 million points), Xiaomi 13 Pro (15.3 million points), and OnePlus 11 (15 million points).

It is worth noting that these benchmark scores are from Qualcomm’s reference device, a smartphone that is powered by the new Snapdragon 8 Gen 3 chip paired with 24GB LPDDR5x RAM at 4.8GHz and 512GB of UFS 4 storage. The reference device has a 6.65-inch full-HD (1,080×2,340 pixels) AMOLED display with a 144Hz refresh rate and packs a 4,192mAh battery. We should can expect to see more benchmarks from handsets running the new chip in the coming weeks and months, starting with the Xiaomi 14 that will be launched in China on Thursday.


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Snapdragon S7 Pro Gen 1 With Micro-Power Wi-Fi and Up to 192kHz Lossless Audio Support Unveiled

Snapdragon S7 Pro Gen 1 and Snapdragon S7 Gen 1 were unveiled by Qualcomm on Tuesday at the company’s annual Snapdragon Summit, where the chipmaker also launched the Snapdragon 8 Gen 3 and Snapdragon X Elite chips for smartphones and laptops. The new Snapdragon S7 Gen 1 series is the successor to the S5 Gen 2 chips from the company. The Pro model is equipped with support for Bluetooth 5.4 and micro-power Wi-Fi connectivity for vastly improved range on upcoming wireless earphones. It is also capable of streaming 192kHz lossless audio and spatial audio.

Expected to arrive on truly wireless stereo (TWS) headsets, wireless earphones, and connected speakers over the coming months, the new Snapdragon S7 Pro Gen 1 audio chip is equipped with support for micro-power Wi-Fi. Aside from Bluetooth 5.4 support, the micro-power Wi-Fi connectivity on wireless headsets along with Qualcomm’s XPAN technology is claimed to extend the coverage from a few metres to “across the home, building, or campus”.

Photo Credit: Qualcomm

 

In addition to the improved range offered on the Snapdragon S7 Pro Gen 1, the more premium model also includes supports for multi-channel lossless audio streaming and multi-channel spatial audio. Both chips support Qualcomm’s hearing loss compensation technology and personal sound amplification features.

The new chips also feature a six-fold improvement in compute power, while AI capabilities have improved by “almost 100 times” due to the new Micro NPU AI engine, according to Qualcomm. The chip is also capable of switching ANC modes, based on machine learning and the wearer’s environment. The S7 Gen 1 series chips also feature support for the firm’s fourth-generation active noise cancellation (ANC) technology.

Qualcomm hasn’t announced details of availability of the new Snapdragon S7 Gen 1 and Snapdragon S7 Pro Gen 1, but products equipped with these are likely to be released in the coming months. The company says that the new wireless audio chips will unlock new sound experiences when paired with the latest Snapdragon 8 Gen 3 SoC or the new Snapdragon X Elite laptop chipset, suggesting that some features may be limited based on hardware.  


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Qualcomm Snapdragon 8 Gen 3 SoC With Generative AI Features, Wi-Fi 7, 240 FPS Gaming Support Launched

Qualcomm announced its latest flagship mobile platform, the Snapdragon 8 Gen 3, on Tuesday at the Snapdragon Summit. The successor to the Snapdragon 8 Gen 2 SoC promises to bring a host of new upgrades and claims to be the first mobile platform focusing on generative AI. The SoC’s AI engine supports multi-modal generative AI models, including popular large language models (LLMs). The Qualcomm Hexagon NPU promises 98 percent faster and 40 percent more efficient performance. It also promises 240 fps gaming on supported displays, featuring global illumination with ray tracing. The Qualcomm Adreno GPU is claimed to be 25 percent faster and more efficient than the one on Snapdragon 8 Gen 2 SoC. The 5G-ready chip supports Wi-Fi 7 and dual Bluetooth.

Qualcomm Snapdragon 8 Gen 3 Availability

According to Qualcomm, flagship Android devices powered by its latest Snapdragon 8 Gen 3 SoC are expected to be available in the coming weeks. The chip will be adopted for flagship devices by global OEMs and smartphone brands, including ASUS, Honor, iQOO, MEIZU, NIO, Nubia, OnePlus, OPPO, realme, Redmi, RedMagic, Sony, Vivo, Xiaomi, and ZTE.

Qualcomm Snapdragon 8 Gen 3 features

The Qualcomm Snapdragon 8 Gen 3 SoC comes with the Qualcomm AI engine, featuring an improved hexagon process claimed to be 98 percent faster and 40 percent more efficient. The chip brings generative AI capabilities, promising the world’s fastest stable diffusion for image generation. The chip is based on the 4nm processing technology, with the Qualcomm Kryo CPU delivering up to 3.3 GHz at 30 percent faster and 20 percent more efficient rates. The CPU comes with five Performance cores, up to 3.2 GHz, and two Efficiency cores, up to 2.3 GHz.

The chip also promises high-end gaming performance, featuring hardware-accelerated ray tracing with global illumination. The chip promises 240 fps gaming on supported displays, with the Qualcomm Adreno GPU claimed to be 25 percent faster and more efficient.

The new chip also promises a bunch of new camera features powered by AI. The chip comes with a Video Object Eraser by Arcsoft that removes unwanted elements and people from a video. It also gets new zoom capabilities, powered by Samsung’s 200-megapixel image sensor optimized for Snapdragon, allowing multiple video capture, object tracking and 2X and 4X zoom. It supports Dolby HDR and features Photo Expansion, which fills up photos with the help of AI.

For connectivity, the Snapdragon 8 Gen 3 brings the Qualcomm FastConnect 7800 System, the same as the Snapdragon 8 Gen 2, with support for Wi-Fi 7 802.11be, 802.11ax, 802.11ac, 802.11a/b/g/n, and Bluetooth 5.4. The latest chip features the Snapdragon X75 5G Modem-RF System. The mobile platform is claimed to feature the world’s first 5G modem with an integrated AI tensor hardware accelerator.

The chip also supports 24-bit 96 kHz lossless music over Bluetooth, USB Version 3.1 Gen 2, USB Type-C, and UFS 4.0 storage.


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OnePlus 12 Tipped to Offer 50W Wireless Charging Support, USB 3.2 Port, More

OnePlus 12 is expected to debut soon as the next-generation flagship offering from the Chinese smartphone brand. OnePlus is yet to confirm the launch date of the handset, but we already know quite a lot about it. Most recently, a Chinese tipster hinted the OnePlus 12 will come with significant upgrades over its predecessor — OnePlus 11. It is said to feature a USB 3.2 port and 50W wireless charging. The OnePlus 12 is tipped to run on Snapdragon 8 Gen 3 SoC. It is said to feature a 6.82-inch curved display with a refresh rate of 120Hz.

Tipster Digital Chat Station (translated from Chinese) on Weibo posted that the OnePlus 12 will be equipped with a USB 3.2 port. The handset is also said to come with support for 50W wireless charging. The OnePlus 11 launched earlier this year with a USB 2.0 port and lacks wireless charging support.

Further, the tipster claims that the OnePlus 12 will feature an infrared sensor. It will allow users to use the handset as a remote control for TV. Additionally, the OnePlus phone is said to come with a periscope camera and run on Snapdragon 8 Gen 3 SoC. These details corroborate past leaks.

According to previous leaks, the OnePlus 12 will feature a 6.82-inch QHD+ (1,440 x 3,168 pixels) curved low-temperature polycrystalline oxide (LTPO) display. The screen made by BOE is said to offer 2,160Hz PWM dimming and 120Hz refresh rate. It is said to pack a triple rear camera unit, comprising a 50-megapixel primary sensor with support for OIS, a 48-megapixel ultra-wide telephoto camera and a 64-megapixel OmniVision OV64B camera.

The OnePlus 12 is said to feature a 32-megapixel selfie sensor. It could pack an alert slider and an in-display fingerprint scanner for authentication. It could house a 5,400mAh battery with fast 100W wired charging support.


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iPhone 16 Pro Models to Get New Ultrawide Camera, Snapdragon X75 Modem, Wi-Fi 7: Report

Apple’s iPhone 15 series is still brand new in the market, but rumours have already begun about next year’s iPhone 16 lineup. Despite the phone being a year away from release, a new report suggests that the iPhone 16 Pro and iPhone 16 Pro Max will come with a 0.2-inch larger display compared to the iPhone 15 Pro models. They could pack Qualcomm’s latest cellular modem for improved 5G performance. Apple is said to retain the Snapdragon X70 modem in the iPhone 16 and iPhone 16 Plus. Further, the Pro models are said to offer Wi-Fi 7 connectivity and might get a new ultra-wide lens on the rear.

As per a report by 9to5Mac citing tech analyst Jeff Pu of Haitong International Securities, the iPhone 16 Pro and iPhone 16 Pro Max models launching in 2024 will feature around 6.3-inch and 6.9-inch display sizes, respectively. If this rumour turns out to be true, it would be a major screen size upgrade over the outgoing iPhone 15 models. Pu affirms they will pack Qualcomm’s latest Snapdragon X75 cellular modem to enable faster and more efficient 5G connectivity.

The analyst states that the regular iPhone 16 and iPhone 16 Plus will continue to use the Snapdragon X70 modem. The latest iPhone 15, iPhone 15 Plus, iPhone 15 Pro, and iPhone 15 Pro Max all feature a Snapdragon X70 modem inside. Similarly, the iPhone 16 Pro model will reportedly offer Wi-Fi 7 connectivity, while the iPhone 16 and iPhone 16 Plus are said to get an upgrade to Wi-Fi 6E. This year’s Pro models have Wi-Fi 6E support.

Further, Jeff Pu adds that both the iPhone 16 Pro and iPhone 16 Pro Max models will have a 12-megapixel tetra-prism lens for better zoom. The Pro lineup is said to include a newer ultra-wide lens as well. Apple will pack a new 48-megapixel ultra-wide camera on the Pro models, adds Pu. This would be a noteworthy upgrade over the iPhone 15 Pro’s 12-megapixel ultra-wide camera.

According to Pu, the iPhone 16 Pro and iPhone 16 Pro Max will be powered by an A18 Pro Bionic chip based on a 3nm process, while the normal iPhone 16 models will get a toned-down version of the A17 Pro chip. For the regular iPhone 16, Pu notes that Apple will pack two rear camera sensors without optical zoom.

The speculation from Jeff Pu is in line with past reports. DSCC analyst Ross Young earlier in May also opined that iPhone 16 Pro models will get a screen size update.

Apple’s iPhone 15 series was launched during its Wonderlust event last month. The iPhone 15 Pro starts at Rs. 1,39,900 for the base 128GB storage model in India, while the iPhone 15 Pro Max begins at Rs. 1,59,900. They are currently up for sale in the country.


Apple unveiled its first mixed reality headset, the Apple Vision Pro, at its annual developer conference, along with new Mac models and upcoming software updates. We discuss all the most important announcements made by the company at WWDC 2023 on Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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MediaTek Dimensity 9300 CPU Clock Speeds Leaked, Said to Be Faster Than Snapdragon 8 Gen 3 SoC

MediaTek releases a new flagship smartphone chipset every year and the Dimensity 9300 is expected to break cover soon. The upcoming MediaTek Dimensity 9300 is expected to debut as an upgrade over the Dimensity 9200 SoC that powers handsets like Oppo Find N3 Flip, and Vivo X90 series. The Taiwanese semiconductor company is yet to confirm details about the new chip, but ahead of it, frequency details of Dimensity 9300 have leaked online. It is said to follow 1+3+4 architecture and is claimed to be 10 percent faster than Qualcomm’s upcoming Snapdragon 8 Gen 3 SoC.

The upcoming MediaTek Dimensity 9300 is believed to pack four Cortex-X4 cores and four Cortex-A720 cores. Now, tipster Digital Chat Station (translated from Chinese) on Weibo has suggested their clock speeds. As per the tipster, the new smartphone chip will feature a prime CPU core with a maximum clock speed of 3.25GHz, three cores with a clock speed of 2.85GHz, and four cores capped at 2.0GHz.

MediaTek is expected to position the Dimensity 9300 as a direct rival to Qualcomm’s yet-to-be-announced Snapdragon 8 Gen 3 SoC. The latter is said to include a prime CPU core with a maximum clock speed of 3.19GHz, five cores with a clock speed of 2.96GHz, and two cores capped at 2.27GHz. Based on the CPU clock speeds, the tipster claims that Dimensity 9300 will be 10 percent faster than the Snapdragon 8 Gen 3 SoC.

The MediaTek Dimensity 9300 is also expected to offer some efficiency and performance improvements over the Dimensity 9200 SoC. The latter is compatible with LPDDR5x memory, UFS 4.0 storage, and packs an Arm Cortex-X3 core at 3.05GHz, three Arm Cortex-A715 cores at 2.85GHz, and four Arm Cortex-A510 cores at 1.8GHz. These CPU cores are made utilising TSMC’s 2nd generation 4nm process.

The Oppo Find X6, Oppo Find N3 Flip, and Vivo X90 series are powered by MediaTek’s Dimensity 9200 SoC. Meanwhile, the upcoming Vivo X100 Pro+ is expected to run on the Dimensity 9300 SoC.


The newly launched Oppo Find N2 Flip is the first foldable from the company to debut in India. But does it have what it takes to compete with the Samsung Galaxy Z Flip 4? We discuss this on Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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Snapdragon 8 Gen 3 Chip Tipped to Cross 2 Million Mark on AnTuTu Benchmark Test With This Hardware Change

Qualcomm’s Snapdragon 8 Gen 3 chip performance details have leaked online, weeks ahead of the expected debut of the upcoming processor for flagship smartphones. This is not the first time that the upcoming mobile chipset has been spotted in performance benchmark tests online, but the latest tests indicate that the chip has surpassed the 2 million mark on the AnTuTu benchmark test. The chipmaker is yet to officially reveal details of the purported Snapdragon 8 Gen 3 chip that is expected to be unveiled at the upcoming Snapdragon Summit 2023 event later this month.

In a post on Weibo, the Chinese microblogging website, tipster Digital Chat Station (translated from Chinese) suggested that there could be a significant difference in performance between the Snapdragon 8 Gen 3 and its predecessor. The benchmark details crossed 2 million points, the tipster claims. The CPU performance benchmark score was over 440,000 points, while the GPU was greater than 840,000 points.

Photo Credit: Screenshot/ Weibo

 

For reference, the AnTuTu score of last year’s Snapdragon 8 Gen 2 was around 1.6 million points, with roughly 380,000 points in the CPU test, while the GPU score was around 600,000 points. The tipster also claims that the Snapdragon 8 Gen 3 will feature “self-developed GPU improvements”, which might explain the bigger jump in performance, compared to the CPU.

The purported score of the Snapdragon 8 Gen 3 is much higher than the previous reported score, which was 17,71,106 points. At the time, the score of the chipset was already higher than the top three devices at the time — the iQoo Neo 8 Pro (1,358,352), Oppo Find X6 Pro (1,307,816), and OnePlus 11 5G (1,324,440).

The tipster notes that typical smartphone hardware was not used to run the benchmark test — a prototype handset was utilised, comprising the new chip along with 16GB of LPDDR5T RAM and an enhanced version of 1TB of UFS 4.0 inbuilt storage.

Announced earlier this year, LPDDR5T (Low Power Double Data Rate 5 Turbo) RAM supports operations at a 9.6Gbps data rate, 16 percent faster than LPDDR5X RAM. However, Digital Chat Station points out that the devices that the Snapdragon 8 Gen 3 might run next are likely to feature LPDDR5X RAM that is also available on current flagship smartphones, which means the benchmarks on future smartphones are unlikely to be as high as this prototype device.


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Apple 3nm Chip Demand for 2024 to Be Below Expectations Amid Declining iPad, MacBook Demand: Ming-Chi Kuo

Apple’s demand for next-generation 3nm chips — for its devices expected to arrive in 2024 — will be lower than market expectations, according to a market analyst. Earlier this month, the Cupertino company unveiled its first smartphone with a 3nm chip, but TF Securities analyst Ming-Chi Kuo states that a decline in shipments for the iPad and MacBook in 2023 could lead to the company lowering its demand for the new chips next year. Meanwhile, Qualcomm is also expected to lower its demand for 3nm chips next year, according to the analyst.

This year, shipments for iPad models declined by 22 percent to 48 million units, while the decline for the MacBook was around 30 percent, to 17 million units, Kuo states in a Medium post. The analyst claims that this drop in shipments was because demand related to work from home (WFH) ended, amid reducing appeal for high-end specifications.

As a result, the company’s demand for next-generation 3nm chips for 2024 will be below expectations, according to Kuo. The analyst also predicts that ASML (formerly Advanced Semiconductor Materials Lithography) will cut its EUV equipment shipment prediction for next year by up to 30 percent due to the reduced demand from Apple, Qualcomm, and Samsung.

In addition to Apple, Qualcomm and Samsung are both expected to reduce demand for 3nm chips in 2024, according to Kuo. The Snapdragon chipmaker is said to be impacted due to two smartphone manufacturers opting to use their own chips — Huawei (Kirin) and Samsung (Exynos). The latter’s flagship phones for 2024 are tipped to feature an Exynos 2400 chipset in markets outside the US, according to recent reports.

Kuo recently claimed in a blog post that complaints of overheating issues affecting Apple’s iPhone 15 Pro models were not related to TSMC’s advanced 3nm chip manufacturing technology. Instead, the analyst cited a market survey to state that the overheating issues are likely to be caused by Apple’s changes to the thermal design of the iPhone 15 Pro and iPhone 15 Pro Max, which feature a titanium frame unlike their predecessors.


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Apple Renews Qualcomm Deal to Cover iPhone Launches Till 2026 in Sign Its Own Modem Chip Isn’t Ready

Apple is extending an agreement to get modem semiconductors from Qualcomm for three more years, a sign that its ambitious effort to design the chips in-house is taking longer than expected. Qualcomm shares surged on the news.

The new pact will cover “smartphone launches in 2024, 2025 and 2026,” Qualcomm said in a statement Monday. The companies’ agreement had been set to end this year, and the latest iPhone — due on Tuesday — was expected to be one of the last to rely on the Qualcomm modem chip.

Instead, Qualcomm will maintain its lucrative position within Apple’s supply chain. The iPhone maker is Qualcomm’s largest customer — accounting for nearly a quarter of revenue, according to data compiled by Bloomberg. And their relationship helps validate Qualcomm’s claim to having the best smartphone modem, a critical component that allows devices to connect to the internet and make calls. Starting with the iPhone 12 generation, the chip has supported speedier 5G networks.

“This agreement reinforces Qualcomm’s track record of sustained leadership across 5G technologies and products,” the San Diego-based chipmaker said. Though the financial terms of the new deal weren’t disclosed, Qualcomm said it was similar to the previous arrangement signed in 2019.

Qualcomm shares jumped more than 8 percent in premarket trading in New York on Monday. Apple was up less than 1 percent.

For Apple, the move suggests that building a modem component has been more challenging than expected. The effort has been years in the works. The Cupertino, California-based company kicked off the project in 2018 and then bolstered it with the acquisition of Intel Corp.’s smartphone chip business in 2019.

By 2020, Apple heralded the development of its own modem as a “key strategy transition.” Johny Srouji, its chip chief, said at the time that the work was full speed ahead.

Some analysts expected the component to be ready for the 2023 iPhone, but Qualcomm quashed that speculation last year. Apple was still looking to ship the modem at either the end of 2024 or in early 2025, Bloomberg News previously reported. Now the project has a longer runway before it needs to be ready.

It’s been a difficult undertaking: Apple needs a chip that can connect to various cellular networks globally without fail, while offering as good or better performance as Qualcomm. It’s run into trouble with battery life, and there are bureaucratic challenges, such as certifying the modem with authorities.

The company’s in-house chip push — branded as Apple Silicon — has had more success elsewhere. Apple replaced the Intel processors in its Macs over the past three years without many hitches, and the battery life and performance gains of those machines have been a selling point.

The company also has been working to replace other semiconductors within the iPhone, including a key Broadcom part. Like Qualcomm, Broadcom counts Apple as its biggest customer. As part of the push, Apple has staffed up in Southern California, where Qualcomm and Broadcom both have offices, aiming to recruit chip talent. The company has teams working on the new wireless chips in Cupertino, San Diego and Germany.

The new agreement comes just a day before Apple’s biggest announcement of the year. The company is set to unveil the iPhone 15, as well as updated Apple Watch models and AirPods, at a presentation Tuesday. It’s counting on the products to help reverse a sales slide that has lasted for three quarters. The iPhone is Apple’s largest single moneymaker, accounting for roughly half of its revenue.

Qualcomm, the world’s largest maker of smartphone chips, has had a turbulent relationship with Apple over the years.

Apple waged legal challenges against a key tenet of Qualcomm’s business model: charging licensing fees for patents that govern the fundamentals of how wireless phone networks operate. Apple eventually lost that fight and agreed, like other major phone makers, to license Qualcomm’s technology. That arrangement will run until 2025, with the option to extend it for another two years.

Because wireless carriers around the world use a wide range of equipment and standards, it’s hard to design technology that works seamlessly. A modem chip has to be able to quickly connect to older 3G and 4G networks, as well as more modern 5G systems. Since the advent of data-centric phones, Qualcomm has led the field.

Though the new contract extends until 2026, Apple could still start using its own modem before then. The company has been planning to gradually roll out the component.

In fact, Qualcomm is only projecting that it will have a 20 percent share of the business when the 2026 iPhone launches. Still, the company used similar wording with the original agreement, suggesting that it could be a conservative forecast.

© 2023 Bloomberg LP


Will the Nothing Phone 2 serve as the successor to the Phone 1, or will the two co-exist? We discuss the company’s recently launched handset and more on the latest episode of Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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Samsung Galaxy S24+ US Model With Snapdragon 8 Gen 3 Chip Spotted on Geekbench, Performance Tipped

Samsung Galaxy S24+ is expected to debut early next year as one of the successors to the Galaxy S23 series of smartphones that were launched by Samsung in February. Months ahead of its expected debut, the handset has been spotted on a benchmarking website, which lists out some of the specifications of the phone. The upcoming S-series flagship smartphone is tipped to arrive in two versions — one powered by Qualcomm’s yet-to-be-unveiled Snapdragon 8 Gen 3 SoC, and the other powered by an in-house Exynos chip from the South Korean company.

A Geekbench listing for a smartphone with the model number SM-S926U, which is believed to be the upcoming Galaxy S24+ handset surfaced on the benchmarking website on Monday. It is listed to be powered by a chipset codenamed pineapple, which is shown to be equipped with a different cluster setup than Qualcomm’s current-generation Snapdragon 8 Gen 2 flagship SoC.

The chipset mentioned in the listing has a prime Cortex-X4 core, that has a clock speed of 3.30GHz along with three Cortex-A720 cores clocked at 3.15GHz, two Cortex-A720 cores clocked at 2.96GHz, and two Cortex-A520 cores clocked at 2.27GHz. The handset could be equipped with 8GB of memory and run on Android 14 out-of-the-box, according to the Geekbench entry.

The listing for the purported handset reveals that it has a score of 2,231 points and 6,661 points in the single-core and multi-core tests, respectively. These scores suggest that the maximum performance improvement will be 20 percent (multi-core performance) over the Snapdragon 8 Gen 2 chipset. The chipset is expected to arrive with an Adreno 750 GPU, which is said to have a 50 percent performance boost over the Adreno 740.

It is worth noting that previous reports suggest Samsung will launch the Galaxy S24 series of smartphones with Snapdragon chips in the US, while users in other regions will get Exynos-powered chipsets. This suggests that the listing for the handset is for the Galaxy S24+ US variant. Meanwhile, it is currently unclear whether the previously mentioned clock speeds of the chipset are for the vanilla Snapdragon 8 Gen 3 chip, or a custom Snapdragon for Galaxy processor like the one launched this year.


Samsung launched the Galaxy Z Fold 5 and Galaxy Z Flip 5 alongside the Galaxy Tab S9 series and Galaxy Watch 6 series at its first Galaxy Unpacked event in South Korea. We discuss the company’s new devices and more on the latest episode of Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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