Snapdragon X Plus With Oryon CPU, 45 TOPS Hexagon NPU for On-Device AI Launched

Snapdragon X Plus was launched on Wednesday as Qualcomm’s latest Arm-based chip for laptops. It follows the launch of the chipmaker’s top-of-the-line Snapdragon X Elite platform. The latest laptop processor is equipped with a 10-core CPU and a 45 TOPS NPU, along with support for 64GB of RAM. Qualcomm has also touted the on-device artificial intelligence (AI) capabilities of the Snapdragon X Plus chip, which comes with support for three external displays at 4K HDR resolution. along with 5G and Wi-Fi 7 connectivity.

The new 4nm Snapdragon X Plus platform (XIP-64-100) is comprised of 10 Oryon CPU cores with a peak clock speed of 3.4GHz, and a 3.8 TFLOPs Adreno GPU. It is also equipped with a 45 TOPS Hexagon NPU from Qualcomm that enables support for on-device AI computing. The chip supports up to 64GB of LPDDR5x RAM, along with NVMe (PCIe Gen 4) or UFS 4.0 or storage.

According to details shared by Qualcomm, the Snapdragon X Plus platform is 37 percent faster than competing processors — that it did not name, but are expected to be Apple’s M-series chips — while offering up to 54 percent better power efficiency. It supports a 4K HDR on-device display with a 120Hz refresh rate, along with up to three 4K HDR external displays simultaneously.

Snapdragon X Plus sits below the flagship Snapdragon X Elite processor (tap to expand)
Photo Credit: Qualcomm

 

The chipmaker demonstrated the on-device AI capabilities of the Snapdragon X Plus using Riffusion for generating music in Audacity, live translation of 100 spoken languages in OBS Studio, and using Codegen to generate fresh code with generative AI (GenAI).

The Snapdragon X Plus is equipped with dual 18-bit Spectra image signal processors (ISP) that supports up to 64-megapixel cameras and up to 4K HDR video recording. The chipset comes with Qualcomm Aqstic audio support, along with the proprietary aptX audio codec.  

Connectivity options on the Snapdragon X Plus include 5G (mmWave, Sub-6GHz), Wi-Fi 7, and Bluetooth 5.4. Cellular connectivity is enabled by the chipmaker’s Snapdragon X65 5G modem, while Wi-Fi and Bluetooth connections work over the Qualcomm FastConnect 7800 connectivity system. The chip also enables USB 4 connectivity with three USB 4 ports, two USB 3.2 Gen 2, and an Embedded USB (eUSB2) port.

According to Qualcomm, laptops with the latest Snapdragon X Plus chip will be available in mid-2024, and the chipmaker is yet to provide a list of OEMs that will introduce new laptop models with the 4nm processor. Customers will be able to purchase laptops powered by Qualcomm’s Snapdragon X Plus and Snapdragon X Elite chips — such as the purported Lenovo Yoga Slim 7 (2024) — in the coming months.


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OnePlus 13 Specifications Tipped; Could Offer a Similar Screen Size as OnePlus 12



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Lenovo Yoga Slim 7 (2024) Design Spotted in Leaked Renders; Could Debut as First Snapdragon X Elite Laptop

Lenovo Yoga Slim 7 (2024) design has been leaked by a tipster, giving us an idea of what to expect from the next laptop in the company’s Slim lineup. It could be the first commercially available laptop to debut with Qualcomm’s Arm-based Snapdragon X Elite chip and run on Windows 11 with a focus on AI performance. The leaked images also show that the Lenovo Yoga Slim 7 (2024) will sport a 14-inch display and will feature a dedicated Microsoft Copilot key.

Tipster WalkingCat (@_h0x0d_) leaked four images of the purported Lenovo Yoga Slim 7 (2024) on X (formerly Twitter). The images shared by the tipster show the purported laptop from various angles, running on what appears to be Windows 11, and the post is captioned “Yoga Slim 7 14(.5) 2024 Snapdragon Edition” suggesting that the laptop will sport a 14-inch or a 14.5-inch screen and will run on a Snapdragon processor.

In the leaked images, we see the rumoured Yoga laptop with a very slim design and Lenovo’s logo in the centre on the lid. It has rounded edges and a slightly raised module for the webcam. The keyboard is surrounded on either side by stereo speakers, while the trackpad is quite large. To the right of the spacebar, we can clearly see a dedicated Copilot key. 

No other specifications of the laptop were shared by the tipster, but this is the first image of a laptop that is expected to debut with Qualcomm’s flagship-grade laptop processor. While Samsung and Microsoft — along with several other OEMs — are expected to equip their laptops with a Snapdragon X Elite chip, we’ve only seen purported benchmarks of these devices.

As per a recent report, Microsoft is said to be confident that its upcoming Surface Pro 10 and Surface Laptop 6 will be capable of beating Apple’s M3-powered MacBook Air, in CPU and AI tasks. The company is also said to be optimistic about the performance of Windows AI PCs with Arm chips to emulate x64 apps — Microsoft expects its emulator will offer better emulation performance than Apple’s Rosetta 2 for Mac computers with Apple Silicon chips, according to the report.


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Snapdragon 7+ Gen 3 With Support for Wi-Fi 7, On-Device AI Generative AI Models Launched

Qualcomm unveiled the Snapdragon 7+ Gen 3 on Thursday as the chipmaker’s most advanced mid-range chipset. The latest addition to the Snapdragon 7-series portfolio comes with support for on-device generative AI models like Llama 2, Gemini Nano, and Baichuan-7B while offering up to 15 percent and 45 percent better CPU and GPU performance compared to previous models, respectively. The chip also comes with support for capturing 200-megapixel images and supports Wi-Fi 7 connectivity along with mmWave and Sub6 5G networks.

Snapdragon 7+ Gen 3 availability timeline

The Snapdragon 7+ Gen 3 (SM7675-AB) will arrive on smartphones from smartphone makers like OnePlus, Realme, and Sharp. The chipmaker said on Thursday that the first smartphone to be equipped with the Snapdragon 7+ Gen 3 is expected to be unveiled within the next two months. The company is yet to reveal details of which markets these smartphones will be available in.

Snapdragon 7+ Gen 3 specifications

According to details shared by Qualcomm, the new Snapdragon 7+ Gen 3 comprises one Arm Cortex-X4 ‘prime’ core clocked at 2.8GHz, four ‘performance’ cores clocked at 2.6GHz, along with three ‘efficiency’ cores with a peak clock speed of 1.9GHz. This chipset supports up to 24GB of LPDDR5x memory at up to 4200MHz and UFS 4.0 storage and USB 3.1 Gen 2 Type-C connectivity.

Snapdragon 7+ Gen 3 is the first chip in the Snapdragon 7-series with Wi-Fi 7 support
Photo Credit: Qualcomm

 

Like Qualcomm’s current-generation flagship chipsets, the Snapdragon 7+ Gen 3 offers support for on -device generative AI models. These include large language models (LLMs) — such as Gemini Nano and Llama 2 — we well as large vision models (LVMs). The company also says that the processor supports on-device multi-language translation and transcription for international media.

The new Snapdragon 7+ Gen 3 supports displays at up to Quad-HD+ resolution with a 120Hz refresh rate and external displays at up to 8K resolution. It offers support for the Qualcomm Aqstic audio codec along with spatial audio and head tracking. Meanwhile, OEMs can also add face unlocking as the chip offers supports an ultra-low power, always-sensing camera.

Qualcomm’s new Snapdragon 7+ Gen 3 is the first chip in the series to be equipped with triple 18-bit image signal processors (ISPs) and it will enable smartphone cameras to capture 200-megapixel images. It supports capturing HDR video at 4K/ 60fps and supports Snapdragon Low Light Vision (LLV) support for videos captured in dark areas. 

On the connectivity front, the new chip from Qualcomm is equipped with a Snapdragon X63 5G Modem-RF system. The chipmaker says that the modem has a peak download speed of up to 4.2Gbps. It supports both mmWave and Sub-6 5G networks, with Dual-Sim Dual Active (DSDA) for 5G and 4G networks.

This is the first Snapdragon 7-series chip to offer support for Wi-Fi 7 networks with high-band simultaneous (HBS) multil-ink, and the Qualcomm FastConnect 7800 mobile connectivity system is claimed to offer download speeds up to up to 5.8Gbps. It also comes with support for the latest Bluetooth 5.4 connectivity, LE audio, Snapdragon Sound, and Qualcomm’s aptX audio codecs, according to Qualcomm. 


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Snapdragon 8 Gen 3 vs Exynos 2400: Benchmarks Hint Samsung’s Chip May Be Almost as Fast as Its Competitor

Qualcomm’s Snapdragon 8 Gen 3 is currently one of the most powerful Android flagship chipsets available today and the chipset is expected to power several flagship smartphones in the coming months — including the upcoming Samsung Galaxy S24 series. The company is reportedly planning to equip some of the handsets in the lineup with an Exynos 2400 chip in most markets. Recent benchmarks of the chip suggest that Samsung’s in-house flagship chip might not be too far behind Qualcomm’s most capable processor.

Previous Exynos flagship chips have trailed their Qualcomm counterparts in terms of performance, but recent entries on the benchmarking website Geekbench (via SamMobile) have shown that the Exynos 2400 chip — expected to power some of the phones in the Galaxy S24 series — has shortened the lead of the Snapdragon 8 Gen 3.

The purported Samsung Galaxy S24+ with a Snapdragon 8 Gen 3 chip scored 2,297 points in the single-core test and 7,104 points in the multi-core test on Geekbench. On the other hand, the Geekbench 6 test for the Samsung Galaxy S24+ with an Exynos 2400 chip shows the phone scored 2,193 points and 6,895 points in the single-core and multi-core tests, respectively.

Samsung Galaxy S24+ Exynos 2400 benchmarks (left) vs the Snapdragon 8 Gen 3 model

 

As SamMobile points out, these scores show a marked improvement for the Samsung Galaxy S24+ with an Exynos 2400 chip, compared to earlier benchmarks. In the past, the Qualcomm chip was 8 percent and 5 percent faster in the single-core and multi-core tests, but the latest tests show they have dropped to 4 percent and 3 percent, closing the gap between both chipsets.

It is worth noting that these are early benchmarks of purported phones that are yet to be released. The scores of these handsets could vary once they are launched. Similarly, benchmarks do not provide the complete picture — the capability of both chips to handle sustained workloads without throttling can be measured once the phones are launched by the company.

Unlike last year, when Samsung equipped the entire Galaxy S23 series with a customised Snapdragon 8 Gen 2 for Galaxy chip, this year’s top of the line Galaxy S24 Ultra is rumoured to be powered by the Snapdragon 8 Gen 3, while the Galaxy S24 and Galaxy S24+ is said to be equipped with either the Snapdragon 8 Gen 2 or Exynos 2400 in different markets.


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Snapdragon 7 Gen 3 Specifications Leak Online, Test Frequencies Hint at Midrange Performance

Snapdragon 7 Gen 3 is tipped to make its debut as the successor to Qualcomm’s Snapdragon 7+ Gen 2 chip and its specifications have surfaced online, giving us an idea of what to expect from the next-generation midrange mobile processor. A tipster has leaked some of the current test frequencies of the upcoming chip, and the values suggest that it will be slightly slower than the previous generation. Qualcomm launched its current Snapdragon 7+ Gen 2 chip in March 2023.

According to details shared by tipster Digital Chat Station (translated from Chinese) on Weibo, Qualcomm’s purported Snapdragon 7 Gen 3 is an octa-core chipset with an Adreno 720 GPU. It will be equipped with a Cortex-A715 prime core clocked at 2.63GHz, three performance cores, and 4 efficiency cores clocked at 2.4GHz and 1.8GHz, respectively.

The core configuration of the purported Snapdragon 7 Gen 3 chip
Photo Credit: Screenshot/ Weibo

 

If we compare the specifications of this chip with the one launched by Qualcomm earlier this year, it appears that the new chip will be slightly less powerful than the Snapdragon 7+ Gen 2. Unveiled in April, the mobile processor is paired with an Adreno 725 GPU. It is equipped with a prime Cortex X2 core clocked at 2.91GHz, three Cortex-A710 performance cores with a peak clock speed of 2.49GHz and four Cortex-A510 efficiency cores, clocked at 1.8GHz.

The tipster claims that smartphones from manufacturers such as Vivo, Honor, and Xiaomi will feature the Snapdragon 7 Gen 3 chip, which bears the SM7550 model number. Just like its predecessor, it will be built on TSMC’s 4nm process, which means it can be expected to offer better power efficiency compared to other smartphones with midrange mobile processors.

Qualcomm is yet to announce a launch date for the purported Snapdragon 7 Gen 3 chip — the company unveiled the Snapdragon 7+ Gen 2 in March with a Snapdragon X62 modem, support for Wi-Fi 6E, Bluetooth 5.3, and Android Ready SE for digital car key support. We can expect the company to reveal details of the Snapdragon 7 Gen 3 in the first quarter of 2024.


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Snapdragon 8 Gen 3 Benchmarks Show New Chip Beats iPhone 15 Pro Max in Geekbench Multi-Core Test

Snapdragon 8 Gen 3 was launched by Qualcomm earlier this week as the company’s newest flagship mobile processor. We can expect the new chipset to feature on flagship smartphones that will debut in the coming weeks and months — starting with the Xiaomi 14 that will be launched in China on Thursday. According to Qualcomm, the new octa-core chip will offer a 30 percent increase in performance and a 20 percent improvement in power efficiency over its predecessor, the Snapdragon 8 Gen 2. Now, benchmarks of the new Snapdragon 8 Gen 3 have been published by the chipmaker, giving us an idea of how it fares against existing smartphones.

Qualcomm’s new Snapdragon 8 Gen 3 is an octa-core mobile processor comprising an Arm Cortex-X4 Prime core at a peak clock speed of 3.3GHz, three Cortex-A720 performance cores at 3.2GHz and two Cortex-A720 cores at 3GHz, along with two Cortex-A520 efficiency cores at 2.3GHz. It is a 4nm processor, unlike Apple’s latest A17 Bionic chip that is fabricated using TSMC’s 3nm process technology.

The chipmaker revealed on Thursday that the Snapdragon 8 Gen 3 scores between 2,320 and 2,229 points on the Geekbench 6 single-core benchmark test. This figure is higher than the score of nearly every other Android smartphone currently available, including the Samsung Galaxy S23 Ultra, OnePlus 11, and Google Pixel 8 Pro. However, Qualcomm’s new chip lags behind the iPhone 15 Plus and iPhone 15 Pro Max, that score around 2,600 and 2,900 points, respectively.

However, in the multi-core Geekbench 6 benchmark test, the Snapdragon 8 Gen 3 scores between 7,439 and 7,526 points. This places the new smartphone chip ahead of the iPhone 15 Pro Max, which has lower scores (around 7,200 points) and iPhone 15 Plus (around 6,400 points). Other handsets powered by last year’s Snapdragon 8 Gen 2 chip score have even lower multi-core benchmark scores, well under the 6,000-point mark.

In the AnTuTu benchmark test, the Snapdragon 8 Gen 3 scored between 2.13 million and 2.14 million points — this score is higher than every single smartphone released by smartphone makers with the Snapdragon Gen 2 chipset — including the iQoo 11 (16 million points), Samsung Galaxy S23 Ultra (15.2 million points), Xiaomi 13 Pro (15.3 million points), and OnePlus 11 (15 million points).

It is worth noting that these benchmark scores are from Qualcomm’s reference device, a smartphone that is powered by the new Snapdragon 8 Gen 3 chip paired with 24GB LPDDR5x RAM at 4.8GHz and 512GB of UFS 4 storage. The reference device has a 6.65-inch full-HD (1,080×2,340 pixels) AMOLED display with a 144Hz refresh rate and packs a 4,192mAh battery. We should can expect to see more benchmarks from handsets running the new chip in the coming weeks and months, starting with the Xiaomi 14 that will be launched in China on Thursday.


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Snapdragon S7 Pro Gen 1 With Micro-Power Wi-Fi and Up to 192kHz Lossless Audio Support Unveiled

Snapdragon S7 Pro Gen 1 and Snapdragon S7 Gen 1 were unveiled by Qualcomm on Tuesday at the company’s annual Snapdragon Summit, where the chipmaker also launched the Snapdragon 8 Gen 3 and Snapdragon X Elite chips for smartphones and laptops. The new Snapdragon S7 Gen 1 series is the successor to the S5 Gen 2 chips from the company. The Pro model is equipped with support for Bluetooth 5.4 and micro-power Wi-Fi connectivity for vastly improved range on upcoming wireless earphones. It is also capable of streaming 192kHz lossless audio and spatial audio.

Expected to arrive on truly wireless stereo (TWS) headsets, wireless earphones, and connected speakers over the coming months, the new Snapdragon S7 Pro Gen 1 audio chip is equipped with support for micro-power Wi-Fi. Aside from Bluetooth 5.4 support, the micro-power Wi-Fi connectivity on wireless headsets along with Qualcomm’s XPAN technology is claimed to extend the coverage from a few metres to “across the home, building, or campus”.

Photo Credit: Qualcomm

 

In addition to the improved range offered on the Snapdragon S7 Pro Gen 1, the more premium model also includes supports for multi-channel lossless audio streaming and multi-channel spatial audio. Both chips support Qualcomm’s hearing loss compensation technology and personal sound amplification features.

The new chips also feature a six-fold improvement in compute power, while AI capabilities have improved by “almost 100 times” due to the new Micro NPU AI engine, according to Qualcomm. The chip is also capable of switching ANC modes, based on machine learning and the wearer’s environment. The S7 Gen 1 series chips also feature support for the firm’s fourth-generation active noise cancellation (ANC) technology.

Qualcomm hasn’t announced details of availability of the new Snapdragon S7 Gen 1 and Snapdragon S7 Pro Gen 1, but products equipped with these are likely to be released in the coming months. The company says that the new wireless audio chips will unlock new sound experiences when paired with the latest Snapdragon 8 Gen 3 SoC or the new Snapdragon X Elite laptop chipset, suggesting that some features may be limited based on hardware.  


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Snapdragon 8 Gen 3 Benchmark Score Hints at Big Improvement in Graphics Performance

Qualcomm’s Snapdragon 8 Gen 3 chipset is expected to be unveiled by the chipmaker at its upcoming Snapdragon Summit 2023 event next month. The company has not yet revealed any details of the anticipated successor to the Snapdragon 8 Gen 2 SoC that was unveiled last year, but several leaks related to its performance have surfaced online in recent months. Now, a benchmark of the purported chipset has surfaced online, giving us an idea of what to expect from the next flagship mobile processor from Qualcomm.

A listing for the purported Snapdragon 8 Gen 3 (via tipster Ice Universe) was posted to the benchmarking site Geekbench on Monday. The listing is titled Qualcomm Pineapple for arm64 and refers to the same codename for the chipset that is expected to debut as the Snapdragon 8 Gen 3 next month. Qualcomm is yet to confirm the name of its next smartphone chip.

According to the entry, the Geekbench 6 Vulkan score for the chip is 15,434 points in the Vulkan test. This is much higher than the score for two gaming smartphones with the Snapdragon 8 Gen 2 that were released last year. The most recent entry for the Nubia Z50S Pro indicates a score of 10,125 points, while the Asus ROG Phone 7 Ultimate scored 9,101 points.

The Snapdragon 8 Gen 2 SoC that powered most flagship smartphones in 2023 is equipped with an Adreno 740 GPU, and the next-generation chipset is expected to feature an Adreno 750 GPU. The Geekbench scores indicate that the graphics performance on the Snapdragon 8 Gen 3 SoC will be around 50 percent higher than its predecessor.

Back in June, an AnTuTu benchmark listing for the Snapdragon 8 Gen 3 was spotted on the Chinese microblogging website Weibo, with a score of 17,71,106 points. The score was much higher than all the top-ranking devices at the time, including the iQoo Neo 8 Pro (13,58,352), OnePlus 11 5G (13,24,440), and Oppo Find X6 Pro (13,07,816). 

However, it is worth taking these scores with a pinch of salt as smartphones launched with the upcoming chipset could offer varying levels of performance based on their build quality, thermal management technology, and software optimisation. We can expect to learn more about the Snapdragon 8 Gen 3 chipset in the days leading to its debut at the Snapdragon Summit 2023 event in October. 


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Qualcomm Snapdragon 4 Gen 2 Mobile Platform With Support for 2.5Gbps 5G Download Speeds Launched

Qualcomm Snapdragon 4 Gen 2 was announced by the chipmaker on Monday as the company’s latest chipset for entry-level 5G smartphones. The new chip is the latest addition to the company’s Snapdragon 4-series and is the successor to the Snapdragon 4 Gen 1 SoC that was launched in 2022. It is also the first chip in the series to be built on a 4nm process node and offers 10 percent performance better performance than its predecessor. The new Snapdragon 4 Gen 2 SoC is equipped with a Qualcomm X61 5G modem that is capable of download speeds of up to 2.5Gbps. It also offers NavIC and dual frequency GNSS support for navigation.

Snapdragon 4 Gen 2 availability timeline

According to details shared by Qualcomm, the newly announced Snapdragon 4 Gen 2 will be used in upcoming smartphone models from manufacturers like Redmi and Vivo, while smartphones equipped with the chipset are expected to be available for purchase in the second half of 2023.

Snapdragon 4 Gen 2 specifications

The new Snapdragon 4 Gen 2 SoC comprises two performance cores clocked at 2.2GHz and six efficiency cores clocked at 2GHz. It is said to offer a 10 percent jump in performance over the Snapdragon 4 Gen 1, along with support for UFS 3.1 storage and up to LPDDR5x RAM at 3200MHz. The chip also comes with support for up to full-HD+ displays with 120Hz refresh rate.

 

The company has also touted its on-device AI technology that offers features like background noise reduction during voice and video calls. The chipset supports USB 3.2 Gen 1 Type-C connectivity along with support for Qualcomm’s Quick Charge 4+ technology which is based on the USB-PD (Power Delivery) standard.

Equipped with the Qualcomm Snapdragon X61 5G modem, the new chip is the first in the Snapdragon 4-series to support the 3GPP Release 16 5G standard. The company says that the modem is capable of download speeds of up to 2.5Gbps. It also offers support for Bluetooth 5.1 dual-band Wi-Fi 5 connectivity. It also supports GPS, GLONASS, Beidou, Galileo, NavIC, and QZSS location services with dual-frequency GNSS (L1 + L5) support. 

For photos and videos, the new Snapdragon 4 Gen 2 SoC supports a dual camera setup with two 16-megapixel cameras or a single 32-megapixel camera. Both setups offer 30fps zero shutter lag support, according to the company. Video capturing is supported at 1080p resolution at 60fps (single camera) and 30fps (dual camera) and at 720p resolution at 120fps (slow-motion). Qualcomm says it has introduced AI features for improved low-light photo and video capturing with noise reduction using Multi Camera Temporal Filtering (MCTF).


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Snapdragon X75, Snapdragon X72 5G Advanced-Ready Modems Announced by Qualcomm Ahead of MWC 2023

Snapdragon X75 and Snapdragon X72 were announced by Qualcomm on Wednesday as the company’s latest modem-to-antenna solutions. The successor to the Snapdragon X70 modem that featured on last year’s flagship smartphones is claimed to be the first in the world to feature support for 5G Advanced connectivity. The new modem is equipped with a dedicated hardware tensor accelerator that offers improved AI performance over its predecessor. It also offers benefits including 10-carrier aggregation for mmWave 5G networks, reduced costs, board complexity, and power consumption, and 5G/4G dual data on two SIM cards simultaneously, according to the company.

Qualcomm says the Snapdragon X75 is the first 5G Advanced-ready next-generation modem-RF system that is 3GPP Release 17 and Release 18-ready. The product brings a new architecture as well as a new software suite from the chipmaker. The Snapdragon X75 is equipped with the Qualcomm 5G AI Processor Gen 2 with a dedicated hardware tensor accelerator, alongside the Qualcomm 5G AI Suite Gen 2 — it is claimed to offer 2.5 times improved AI performance compared to the previous generation.

The company’s next-generation 5G Advanced-ready modem will be the first to offer 10-carrier aggregation for mmWave 5G, while users on sub-6Hz 5G networks can take advantage of 5x downlink carrier aggregation and frequency-division duplexing (FDD) uplink, Qualcomm says. The Snapdragon X75 also allows device makers to reduce costs, hardware size, board complexity and power consumption, thanks to a converged transceiver for mmWave and sub-6Ghz 5G networks and the QTM565 mmWave antenna.

Qualcomm is also touting the AI capacities of the new 5G modem, including location accuracy enhancements and improved connectivity in elevators, subway trains, airports, parking lots, or even during mobile gaming sessions. It will also enable support for Qualcomm DSDA Gen 2 connectivity, which means users will be able to use 5G/4G dual data simultaneously on two SIM cards. The Snapdragon X75 modem will also offer Snapdragon Satellite support, the company’s next-generation technology that was unveiled at CES 2023.

The company expects the new Snapdragon X75 modem to make its way to commercial devices including smartphones, mobile broadband devices, automotive products, computers, and satellite communication services, by the second half of this year. “5G Advanced will take connectivity to a whole new level, fuelling the new reality of the Connected Intelligent Edge,” said Durga Malladi, Senior Vice President and General Manager, Cellular Modems and Infrastructure, Qualcomm, in a prepared statement.

Meanwhile, Qualcomm also unveiled its Snapdragon X72 5G modem-RF system that supports multi-Gigabit upload and download speeds. The company claims it has been optimised to increase adoption of mobile broadband applications. However, the company is yet to reveal additional information about the product, including detailed performance statistics and availability on commercial devices.

Qualcomm says the Snapdragon X75 will also power the company’s new Qualcomm Fixed Wireless Access (FWA) Platform Gen 3, which it claims is the first fully integrated FWA platform with 5G Advanced-ready connectivity. This means that customers will have access to mmWave and sub-6GHz 5G, along with next-generation Wi-Fi 7 support with up to 10Gbps connectivity. While details of availability are yet to be announced, Qualcomm says the FWA platform will offer multi-gigabit speeds and “wire-like” latency to indoor devices, while allowing mobile operators to economically deliver fibre-like Internet speeds over 5G to rural, suburban, and dense urban communities.


The OnePlus 11 5G was launched at the company’s Cloud 11 launch event which also saw the debut of several other devices. We discuss this new handset and all of OnePlus’ new hardware on Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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