MediaTek Dimensity 8300 Chipset With Support for Generative AI, Stable Diffusion Unveiled

MediaTek on Tuesday unveiled the Dimensity 8300 as the company’s latest processor for Android smartphones. Built on TSMC’s advanced second-generation 4nm process technology, it features 20 percent improved performance and 30 percent less power consumption over its predecessor. The company’s new chipset offers full generative AI support, including large language models (LLMs) and technology such as Stable Diffusion. The chip supports up 320-megapixel cameras and 5G network downlink speeds of up to 5.17Gbps, according to the company.

The newly unveiled Dimensity 8300 mobile processor is an octa-core chip with four Arm Cortex-A715 performance cores and four Cortex-A510 efficiency cores, clocked at 3.35GHz and 2.2GHz, respectively. It supports LPDDR5x member and UFS 4 storage with Multi-Circular Queue (MCQ) support. Previous benchmark scores suggest that this chip can keep up with Qualcomm’s second most powerful chip, the Snapdragon 8 Gen 2 SoC.

In addition to the aforementioned CPU improvements, the chip has a Mali-G615 GPU that is claimed to use 55 percent less power while offering 60 percent improved performance over last year’s model. The chip also features MediaTek’s HyperEngine game technology that monitors device temperature and keeps device from running hot during gaming sessions, according to the company.

For photos and videos, the MediaTek Dimensity 8300 features an Imagiq 980 ISP that is claimed to offer 4K60fps HDR with support for longer video recording, due to improvements to power consumption. it supports smartphone cameras with a maximum resolution of 320 megapixels.

MediaTek has equipped the Dimensity 8300 with an APU 780 AI processor with a similar architecture as the more advanced Dimensity 9300 chipset, leading to a 2x and 3.3x increase in performance in INT/FP16 computation and AI performance, respectively. Meanwhile, it supports on-device generative AI technology with up to 10 billion parameters as well as support for Stable Diffusion, according to the chipmaker.

On the connectivity front, the new Dimensity 8300 has a 3GPP Release-16 modem with 5G and 4G LTE support. The chipset also comes with Wi-Fi 6E and Bluetooth 5.4 support, along with GPS, GLONASS, and NavIC support for satellite-based navigation.

According to MediaTek, 5G handsets running on the newly unveiled Dimensity 8300 chip will be launched before the end of the year. The chip is expected to compete with Qualcomm’s Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 chips. While specific models featuring the MediaTek chip are yet to be announced, we can expect to see smartphone makers announce upcoming models featuring the mobile chipset in the coming weeks and months.


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MediaTek Dimensity 9300 CPU Clock Speeds Leaked, Said to Be Faster Than Snapdragon 8 Gen 3 SoC

MediaTek releases a new flagship smartphone chipset every year and the Dimensity 9300 is expected to break cover soon. The upcoming MediaTek Dimensity 9300 is expected to debut as an upgrade over the Dimensity 9200 SoC that powers handsets like Oppo Find N3 Flip, and Vivo X90 series. The Taiwanese semiconductor company is yet to confirm details about the new chip, but ahead of it, frequency details of Dimensity 9300 have leaked online. It is said to follow 1+3+4 architecture and is claimed to be 10 percent faster than Qualcomm’s upcoming Snapdragon 8 Gen 3 SoC.

The upcoming MediaTek Dimensity 9300 is believed to pack four Cortex-X4 cores and four Cortex-A720 cores. Now, tipster Digital Chat Station (translated from Chinese) on Weibo has suggested their clock speeds. As per the tipster, the new smartphone chip will feature a prime CPU core with a maximum clock speed of 3.25GHz, three cores with a clock speed of 2.85GHz, and four cores capped at 2.0GHz.

MediaTek is expected to position the Dimensity 9300 as a direct rival to Qualcomm’s yet-to-be-announced Snapdragon 8 Gen 3 SoC. The latter is said to include a prime CPU core with a maximum clock speed of 3.19GHz, five cores with a clock speed of 2.96GHz, and two cores capped at 2.27GHz. Based on the CPU clock speeds, the tipster claims that Dimensity 9300 will be 10 percent faster than the Snapdragon 8 Gen 3 SoC.

The MediaTek Dimensity 9300 is also expected to offer some efficiency and performance improvements over the Dimensity 9200 SoC. The latter is compatible with LPDDR5x memory, UFS 4.0 storage, and packs an Arm Cortex-X3 core at 3.05GHz, three Arm Cortex-A715 cores at 2.85GHz, and four Arm Cortex-A510 cores at 1.8GHz. These CPU cores are made utilising TSMC’s 2nd generation 4nm process.

The Oppo Find X6, Oppo Find N3 Flip, and Vivo X90 series are powered by MediaTek’s Dimensity 9200 SoC. Meanwhile, the upcoming Vivo X100 Pro+ is expected to run on the Dimensity 9300 SoC.


The newly launched Oppo Find N2 Flip is the first foldable from the company to debut in India. But does it have what it takes to compete with the Samsung Galaxy Z Flip 4? We discuss this on Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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Qualcomm Predicts Q4 Sales Below Market Estimates Due to Macroeconomic Headwinds, Weaker Global Handset Units

Qualcomm forecast fourth-quarter sales below market expectations on Wednesday and said it would likely cut jobs as consumer spending on gadgets like smartphones remained stubbornly weak amid slowing global economic growth.

The San Diego, California-based company said it also expects no further sales to Chinese telecom giant Huawei [HWT.UL] because it does not have a license to sell 5G chips to Huawei. More broadly in China, a slower-than-expected economic recovery weighed on orders to Qualcomm. Smartphone shipments in the world’s second-largest economy were down 5 percent in the June quarter, Canalys data showed.

Qualcomm said its forecast also takes into account the impact of macroeconomic headwinds, weaker global handset units, and the fact that phone makers are using existing inventory rather than putting in fresh chip orders.

On a conference call with investors, Chief Financial Officer Akash Palkhiwala said Qualcomm’s forecast for the rest of the year assumes no “material revenue” from Huawei.

“As you are aware we have a 4G license for shipping into Huawei. We do not have a 5G license, and we are not assuming any material revenue going forward,” Palkhiwala said.

The company estimated fourth-quarter revenue of $8.1 billion to $8.9 billion (roughly Rs. 66,978 crore), while analysts polled by Refinitiv expected $8.70 billion (roughly Rs. 71,949 crore). Qualcomm forecast a fourth-quarter adjusted earnings range with a midpoint of $1.90 (roughly Rs. 157), in line with analysts’ consensus estimate of $1.91 (roughly Rs. 158) per share according to Refinitiv data.

Qualcomm warned of likely restructuring charges for job cuts.

“While we are in the process of developing our plans, we currently expect these actions to consist largely of workforce reductions, and in connection with any such actions we would expect to incur significant additional restructuring charge,” the company said in a securities filing.

Qualcomm shares fell about 7 percent in choppy extended trading.

At a conference in May, Qualcomm CEO Cristiano Amon said he had not seen signs of healthy consumption in China yet and the smartphone industry recovery was “a number of quarters out.”

Qualcomm rival MediaTek last week warned that phone manufacturers are “cautious” about buying chips due to tepid end-user demand.

Qualcomm said on Wednesday it expected the use of existing inventory by phone makers “will be a factor through the end of the calendar year.”

Qualcomm shares fell amid a broader sell-off in tech and chip stocks, with Philadelphia SE Semiconductor Index slipping 3.5 percent. Analysts are expecting Apple to report its largest fiscal third-quarter revenue drop since 2016 later this week as iPhone sales slow in the US and elsewhere.

But other chip firms are seeing different results. Shares of Qorvo, which also supplies wireless chips to smartphone makers, rose 4 percent in extended trading after its forecast beat analysts’ expectations and CEO Bob Bruggeworth said it had won more business with its “largest customer,” which is Apple. Apple. NXP last week reported better-than-expected results partly on the strength of Apple orders.

CEO Amon said the company will be supplying modem chips for Apple’s next iPhone.

Kinngai Chan, the analyst at Summit Insights Group, said Huawei is not a large Qualcomm customer and the US company’s stock declined because its outlook is “much weaker than expectations” amid flat Android handset sales.

Revenue at Qualcomm’s mainstay handset chip business fell 25 percent to $5.26 billion (roughly Rs. 15843,489 crore) in the third quarter. Adjusted overall revenue of $8.44 billion (roughly Rs. 69,788 crore) missed estimates of $8.50 billion (roughly Rs. 70,284 crore).

It forecast adjusted fourth-quarter earnings per share of $1.80 (roughly Rs. 148) and $2 (roughly Rs. 165), compared to estimates of $1.91 (roughly Rs. 158).

The automotive sector was a bright spot as Qualcomm seeks to diversify beyond smartphone chips. Revenue from the sector grew 13 percent on the increasing use of computer chips in vehicles. 

© Thomson Reuters 2023 


Samsung launched the Galaxy Z Fold 5 and Galaxy Z Flip 5 alongside the Galaxy Tab S9 series and Galaxy Watch 6 series at its first Galaxy Unpacked event in South Korea. We discuss the company’s new devices and more on the latest episode of Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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OnePlus Ace 2 Variant With MediaTek Dimensity 9000 SoC Tipped to Launch Soon: Details

OnePlus Ace 2 was launched in China earlier this month. The same phone also came to India as a rebranded OnePlus 11 5G. Both variants were equipped with a Qualcomm Snapdragon 8+ Gen 1 SoC. However, as per a new leak, OnePlus is now gearing up to launch a OnePlus Ace 2 model that would use a MediaTek Dimensity SoC. The display of the OnePlus Ace 2 with the Dimensity SoC is also expected to be a 1.5K resolution flat screen instead of the curved AMOLED panel seen on the OnePlus Ace 2.

According to a report by MyDrivers, which cites tipster Digital Chat Station’s Weibo post, OnePlus is gearing up to launch a OnePlus Ace 2 variant that will feature a MediaTek Dimensity 9000 SoC and a 1.5K flat display. The standard OnePlus Ace 2 and the OnePlus 11R 5G smartphones feature a 6.74-inch full-HD+ curved AMOLED display. The new smartphone is expected to be priced a little lower than the OnePlus Ace 2, and OnePlus 11R 5G, as per the report.

MediaTek’s Dimensity 9000 SoC is its latest chipset and a flagship processor. The SoC is manufactured using a 4nm process. If this report is true, then it will replace the Qualcomm Snapdragon 8+ Gen 1 SoC found on the standard OnePlus Ace 2. The Snapdragon 8+ Gen 1 SoC isn’t the latest Snapdragon SoC available in the market currently.

According to the report, apart from the processor and display specifications, all other specifications, features, and design of the smartphone are expected to remain the same as the OnePlus Ace 2 or OnePlus 11R 5G.

To recall, the OnePlus Ace 2, and OnePlus 11R 5G launched in China, and India respectively, with a triple rear camera setup, which includes a 50-megapixel Sony IMX890 primary sensor, an 8-megapixel ultra wide-angle sensor, and a 2-megapixel macro lens. The rear camera setup supports 10x digital zoom, 4K video recording at 30fps (frames-per-second), EIS (electronic image stabilisation) and OIS (optical image stabilisation). For selfies, the smartphones come with 16-megapixel shooter that is housed in a centrally alligned punch-hole cutout.

However, it is worth noting that OnePlus has not provided any official confirmation on the possibility of a new OnePlus Ace 2 variant with the MediaTek Dimensity chipset as of yet.


Samsung’s Galaxy S23 series of smartphones was launched earlier this week and the South Korean firm’s high-end handsets have seen a few upgrades across all three models. What about the increase in pricing? We discuss this and more on Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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Intel Said to Plan Thousands of Job Cuts Amid Ongoing PC Market Slowdown

Chipmaker Intel is planning a major reduction in headcount, likely numbering in the thousands, in the face of a slowdown in the personal computer market, Bloomberg News reported on Tuesday, citing people with knowledge of the situation.

The layoffs will be announced as early as this month and some of Intel’s divisions, including the sales and marketing group, could see cuts affecting about 20 percent of staff, according to the report.

The company had 113,700 employees as of July, Bloomberg News said.

Intel declined to comment on the job cuts.

The company in July slashed its annual sales and profit forecasts after missing estimates for second-quarter results.

Decades-high inflation and the reopening of offices and schools have led people to spend less on PCs than they did during pandemic-related lockdowns.

Chipmakers are also under pressure from COVID-19 curbs in key PC market China and the Ukraine conflict that have led to supply-chain snarls and also weighed on demand.

Intel’s Chief Executive Officer Pat Gelsinger released a memo to company employees on Tuesday outlining plans to create an internal foundry model for external customers and the company’s product lines.

A foundry business builds chips that other companies design and Taiwan Semiconductor Manufacturing Company (TSMC) is the top player in that space. Intel has mainly built chips it designed itself so far.

Back in July, Intel announced it will produce chips for Taiwan’s MediaTek, one of the world’s largest chip design firms.

The manufacturing arrangement is one of the most significant deals Intel has announced since it launched its so-called foundry business early last year.

While Intel didn’t give any financial details of the deal or say how many chips it would be producing for MediaTek, it said the first products would be manufactured in the next 18- to 24- month period and will be in a more mature technology process called Intel 16, with the chips used for smart devices.


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Poco C40, C40+ Confirmed in an Official Community Forum Post

Poco C40 and Poco C40+ names have been confirmed by Poco in a community forum post. The smartphones are expected to join the smartphone brand’s affordable C-series lineup. In an official community forum post, Poco was seeking testers for its MIUI Global Stable ROM. The community post also highlighted the names of the smartphones for which the company is seeking testers. The names in the list included two of Poco’s M-series and C-series smartphones each and also smartphones from the X-series lineup. The Poco C40 was also recently spotted on the National Broadcasting and Telecommunications Commission (NBTC) and Bureau of Indian Standards (BIS) websites with the same name.

A Poco community forum post looking for testers for MIUI Global Stable ROM has confirmed the moniker of the two rumoured smartphones that are said to join the Poco’ C-series lineup. The post highlighted the names of the smartphones for which the testers are required. The list also included the name Poco C40 and Poco C40+. Other names in the list were Poco M4 5G, Poco M4 Pro, and Poco X4 Pro 5G.

Poco C40 series has officially been confirmed?
Photo Credit: Poco Community

 

Previously, the Poco C40 has been spotted on multiple occasions with the same moniker and a model number. According to a recent report, Poco C40 was spotted on the NBTC Thailand and BIS websites under the C40 moniker and indicated that the new Poco smartphone can be expected to launch soon. As spotted, the NBTC Thailand has granted approval to the smartphone with model number 220333QPG.

To recall, the upcoming smartphone’s specifications have also been leaked in the past. Poco C40 is expected to sport a JR510 SoC instead of a Qualcomm, MediaTek, or a Unisoc SoC, according to a report. The smartphone is also expected to feature MIUI Go, a special version of the MIUI operating system.

The smartphone manufacturer is yet to confirm details about the release timeline, pricing, or availability in India and global markets.


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Millions on Android Devices Exposed by Unpatched Apple Lossless Codec Flaw: Researchers

Security flaws in an audio codec have been uncovered by security researchers, putting millions of Android phones and other Android devices powered by chipsets from MediaTek and Qualcomm at risk of being compromised by hackers. Stemming from an codec created by Apple several years ago, the vulnerabilities were left unpatched since the company open-sourced the codec 11 years ago, for inclusion on non-Apple devices. By leveraging the security flaws, an attacker could remotely get access to an Android phone’s media and audio conversations, according to the researchers.

According to a report by researchers at Check Point Research, a flaw in the Apple Lossless Audio Codec (ALAC) from Apple allows an attacker to perform a remote code execution (RCE) attack on a target smartphone, after sending a malformed audio file. An RCE attack can allow the attacker to gain control of multimedia on the handset, including streaming video from the cameras, accessing media and user conversations.

The security flaws were discovered in Apple’s ALAC codec, which was open-sourced by the company in 2011 — allowing non-Apple devices to stream music in ‘lossless’ quality using Apple’s previously proprietary codec. However, while Apple patched the proprietary version of the ALAC codec, the open-source version remained unpatched, according to the researchers.

As a result, Qualcomm and MediaTek, chipset manufacturers who ported the vulnerable ALAC codec to their audio decoders, resulting in over two thirds of all smartphones sold in 2021 being vulnerable to the security flaws, dubbed “ALHACK”, according to the researchers. The vulnerabilities were responsibly disclosed to Qualcomm and MediaTek, who both acknowledged the issues and assigned Common Vulnerabilities and Exposures (CVE) for the flaws. MediaTek assigned CVE-2021-0674 and CVE-2021-0675 (with ‘Medium’ and ‘High’ ratings, respectively), while Qualcomm assigned CVE-2021-30351 (with a ‘Critical’ rating of 9.8 out of 10) for the ALAC flaws, before patching them.

According to the researchers, both companies have issued patches for the flaws included in the December 2021 Android security bulletin, which means that users with smartphones that received the December security patches should be safe from the vulnerabilities. However, this leaves out millions of users running outdated software, or users who receive erratic security updates — putting them at risk of being compromised by attackers.


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