Tag: soc

Vedanta Chairman Says Their $5 Billion Made-in-India Chip Will Be Ready in 2.5 Years

Vedanta group chairman Anil Agarwal on Friday said that the first phase of its semiconductor project will involve a $5 billion (roughly Rs. 41,300 crore) investment of the overall $20-billion (roughly Rs. 1,64,500 crore) outlay, and the venture will be ready with made-in-India chip in two and a half years.

Vedanta is talking to three companies to rope them in as technology partners for its mega plans entailing foundry, chip manufacturing, and packaging and design.

“In 2.5 years, we will give you Vedanta made-in-India chips,” Agarwal told reporters on the sidelines of the SemiconIndia 2023 event.

The first phase of its semiconductor investment will be to the tune of $5 billion (roughly Rs. 41,300 crore), which is being structured.

“Vendata has a good cash flow, we will make a capital allocation in Vedanta and there is a queue of people to give us equity and debt…but we want the tie-ups to be in place first, and have an ecosystem,” he said.

After parting ways with Foxconn on their semiconductor joint venture, Vedanta group has made it clear that it remains committed to building India’s first semiconductor and display fabs in Dholera Special Investment Region in Gujarat, and substantial progress has happened to tie up with technology and equity partners in semiconductors.

Both Foxconn and Vedanta have now decided to apply for Indian chip-making incentives separately.

Foxconn has said it is working on plans to apply for incentives under the semiconductor and display fab programme, as the contract manufacturer pledged its commitment to India.

The Taiwanese electronics manufacturing giant said it has been actively reviewing the landscape for optimal partners.

India is wooing semiconductor and display manufacturers with a $10-billion (roughly Rs. 82,300 crore) incentive scheme, making a determined push to position itself as a global powerhouse for chip making.

Sophisticated chips are part of everyday life, used in mobile phones, refrigerators and cars to high-tech industries, and so fostering local industry with carefully-crafted schemes and policy sweeteners will link India to an ever-growing global chip market.

As it is, the global semiconductor shortage has emphasised the importance of this critical component in modern-day electronics.

Samsung launched the Galaxy Z Fold 5 and Galaxy Z Flip 5 alongside the Galaxy Tab S9 series and Galaxy Watch 6 series at its first Galaxy Unpacked event in South Korea. We discuss the company’s new devices and more on the latest episode of Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.

(This story has not been edited by NDTV staff and is auto-generated from a syndicated feed.)

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Snapdragon 8 Gen 3 SoC Details Leak, Tipped to Feature Reworked CPU Clusters, Drop 32-Bit Support

Details about Qualcomm’s next-gen flagship SoC have begun trickling in, months ahead of its expected debut. The upcoming Snapdragon 8 Gen 3 SoC is said to feature a restructured CPU cluster layout, and will most likely support only 64-bit computing, removing all 32-bit support. The chip is said to be codenamed either Lanai or Pineapple, and is expected to be launched in late 2023, possibly during Qualcomm’s annual Summit in Hawaii. If the company’s past launches are anything to go by, then we’ll probably also see debut of a Snapdragon 8+ Gen 2 SoC as a mid-year refresh with improved thermal performance and power efficiency. It’s hard to say if the Gen 3 SoC will actually arrive in phones this year or if we will have to wait until 2024.

The details come via a thread on Twitter by Kuba Wojciechowski (@Za_Raczke) who claims that this next-gen chip will have the model number SM8650, and will be codenamed Lanai, or Pineapple. The tweet states that it will have a new CPU configuration with a 2+3+2+1 structure. This includes two ARM Hayes (A5XX) “Silver” cores, three ARM Hunter (A7XX) “Gold” cores, two ARM Hunter (A7XX) “Titanium” cores, and one ARM Hunter ELP (Xn) “Gold” core. This will be Qualcomm’s first chip to have “Titanium” cluster and as of now, it’s unclear how it will differ from the “Gold” cluster. Wojciechowski mentions that this new cluster could be configured differently with more cache, or could simply be clocked higher.

The tweet further explains that the ARM Hunter and Hunter (ELP) are brand new, unannounced CPU cores. This new cluster configuration will be very different from the current 1+4+3 layout, and seems to contradict the earlier leak we had which suggested the Snapdragon 8 Gen 3 would have a 1+5+2 configuration.

Wojciechowski claims that Qualcomm’s code also confirms that this SoC will only support 64-bit computing. The GPU in the upcoming chip is said to be the Adreno 750 and currently has a peak clock speed of 770MHz — although it’s possible that this could change by the time the SoC is announced. The Snapdragon 8 Gen 3 is also said to run on version 6.1 of the Linux kernel with Android 14.

Previous rumours suggested that the Qualcomm Snapdragon 8 Gen 3 SoC could launch early this year and would receive a 25 percent bump in performance. If this is indeed true, then it’s also possible that Qualcomm might skip a Snapdragon 8+ Gen 2 model and directly release its successor.

The newly launched Oppo Find N2 Flip is the first foldable from the company to debut in India. But does it have what it takes to compete with the Samsung Galaxy Z Flip 4? We discuss this on Orbital, the Gadgets 360 podcast. Orbital is available on Spotify, Gaana, JioSaavn, Google Podcasts, Apple Podcasts, Amazon Music and wherever you get your podcasts.
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MediaTek Plans to Open New Design Center in the US With $1.4 Million Aid From the State

Taiwan’s MediaTek, the world’s fourth largest chip designer by revenue, plans to create a new design center in Indiana in partnership with Purdue University, the firm told Reuters. MediaTek, which makes processors for many Android phones and smart speakers, declined to say how much it would invest in its first Midwestern design hub, but said it will receive $1.4 million (nearly Rs. 11 crore) from the state for the center.

“Being in Indiana means we’ll have access to some of the best engineering talent in the world,” said Dr. Kou-Hung Lawrence Loh, corporate senior vice president of MediaTek Iand president of MediaTek USA, in a statement the company plans to release later on Tuesday.

The company will seek to hire engineers from top schools in Indiana and nearby states that it would normally recruit to its design centers in California or the Northeast, it said.

MediaTek also said it plans to endow a professorship at Purdue to compete for federal research grants, a funding source that could see a large boost if a bill to support the chip industry gets congressional approval. The announcement will come after Taiwan’s GlobalWafers said on Monday it will build a $5 billion (nearly Rs. 39,500 crore) silicon wafer plant in Sherman, Texas, as a global shortage of semiconductor chips continues to bite supply chains, forcing some automotive and electronics firms to scale back production.

In a related development, last week MediaTek Dimensity 9000+ was unveiled as the company’s latest smartphone system-on-chip (SoC). The new Dimensity chipset is rated to deliver a five percent boost in CPU performance and more than 10 percent improvement in GPU performance over the Dimensity 9000. The Dimensity 9000+ comes with support for up to 180Hz full-HD+ displays and up to 320-megapixel cameras. It also includes support for the latest Wi-Fi and Bluetooth connectivity. The Dimensity 9000+ carries an integrated 5G modem to support high-speed data access.

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