iPhone 17 Pro Models to Arrive in 2025 With 2nm Chipset Built by TSMC: Report

Apple is planning to launch the first iPhone equipped with a processor built on a 2nm process in 2025, according to a report. The Cupertino company will reportedly launch the iPhone 17 Pro and iPhone 17 Pro Max with a next generation chipset from TSMC. The iPhone 15 Pro models were the first phones from Apple to be equipped with a 3nm A17 Pro chip, while the standard iPhone models still run on the 4nm A16 Bionic chipset that previously powered the Pro models launched in 2022.

According to a DigiTimes report (via Apple Insider) citing supply chain sources, Taiwan Semiconductor Manufacturing Co (TSMC) is preparing a new chip manufactured on its 2nm process for the iPhone 17 Pro models that are expected to launch in the second half of 2024. Apple is also expected to introduce Mac models with 2nm chips in the future, but the report does not specify a timeline for these processors.

With TSMC on track to produce the 2nm chips that will be built on its “N2” process technology, the iPhone 17 Pro and iPhone 17 Pro Max are likely to be the first smartphones to feature the next generation chips, while the standard iPhone 17 models could be equipped with a previous generation chipset, a process Apple has followed since the iPhone 14, which featured the same chip as the iPhone 13 Pro.

While the Taiwanese chip firm will start production of 2nm chip designs next year, it is also working on a more advanced version of the “N2” process technology for even better 2nm chips that will be ready by 2026-end, according to the report. This suggests that the first iPhone models with chips built on the “N2P” process technology could be from the iPhone 19 series that could debut a year later in 2027.

TSMC is also working on its more advanced “A14” process technology, which will allow it to produce 1.4nm chipsets, according to the report. However, there’s currently no word on a timeline for production of chips on the advanced process technology, which means it could be years before an iPhone model is launched with a 1.4nm processor.


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TSMC Says Its IT Hardware Supplier Targetted in Cyberattack

Taiwan Semiconductor Manufacturing said on Friday that a cybersecurity incident involving one of its IT hardware suppliers has led to the leak of the vendor’s company data.

“TSMC has recently been aware that one of our IT hardware suppliers experienced a cybersecurity incident which led to the leak of information pertinent to server initial setup and configuration,” the company said.

TSMC confirmed in a statement to Reuters that its business operations or customer information were not affected following the cybersecurity incident at its supplier Kinmax.

The TSMC vendor breach is part of a larger trend of significant security incidents affecting various companies and government entities.

Victims range from U.S. government departments, UK’s telecom regulator, to energy giant Shell, all affected since a security flaw was discovered in Progress Software’s MOVEit Transfer product last month.

TSMC said it has cut off data exchange with the affected supplier following the incident.

TSMC also announced in April that it will release new software this year to help customers working on advanced computer chips for cars take advantage of its newest technologies more quickly.

TSMC is the world’s biggest contract manufacturer of semiconductors. Many of the automotive industry’s biggest chip suppliers such as NXP Semiconductor and STMircoelectronics NV tap TSMC to make their chips.

But automotive chips must meet a higher bar for ruggedness and longevity than the chips that go into consumer electronics. TSMC has special manufacturing processes for the automotive industry that typically arrive a couple years after similar processes for consumer chips.

In the past it has then taken automotive chip firms extra time to create chip designs for those specialised manufacturing lines. The result was that car chips could be years behind those in the latest smartphone.

© Thomson Reuters 2023
 


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