Tag: 2nm chipsets

Leaked: Apple’s Plans for 2nm iPhone Processor, Qualcomm Working on 3nm, 4nm Nodes for XR/VR Headset

Apple’s iPhone 15 Pro and iPhone 15 Pro Max are the only widely available smartphones which offer processors designed using the 3nm fabrication process. Going smaller brings several advantages and allows manufacturers to package more components, adding more features while also making these processors more power efficient. The iPhone 15 Pro models, launched late last year, are capable of running AAA gaming titles with high-end graphics, which is currently not possible with the same level of efficiency on an Android smartphone with a 4nm Qualcomm Snapdragon SoC inside. Turns out, Apple isn’t resting on its laurels yet, as a new report indicates that it’s already begun work on 2nm processor designs.

A report by gamma0burst shows a rather confidential document with tons of redacted information, revealing that Apple has begun work on designing its next 2nm SoCs. There’s no information about when these will arrive in a device or even which devices these are being designed for, but given that the current-day iPhones have the most power efficient mobile chipsets available, there’s a good chance these could show up in future iPhone models.

As per the latest report, Apple will go with a 3nm processor (possibly called the A18 and A18 Pro) for the upcoming iPhone 16 Pro and 16 Pro Max models, keeping in mind last year’s release strategy. We have already seen leaked benchmarks revealing higher scores than the currently available model. The Apple iPhone 16 series and 16 Pro series aren’t expected until Q3, this year. According to a previous report by Phone Arena, TSMC is expected to start 2nm chip production by 2025, so there is a good chance we could see these new processors arrive with the iPhone 17 Pro and iPhone 17 Pro Max.

Leaked slides on Apple and Qualcomm
Photo Credit: gamma0burst

 

The leaked documents also shed light on Qualcomm’s current efforts. It reveals that Qualcomm is working on 3nm and 4nm platforms for its extended reality (XR) and virtual reality (VR) SoCs, which should give them an edge keeping in mind Apple’s Vision Pro and its M2 chips (5nm).

However, this does not entirely mean that Qualcomm will fall another generation behind when Apple readies its 2nm silicon. An older report by Wccftech, did mention that Qualcomm is actively looking at samples from Samsung and TSMC to figure out a strategy for its Snapdragon Gen 5 platform. The currently available Qualcomm Snapdragon 8 Gen 3 processor found in devices like the OnePlus 12 uses a 4nm process, while Qualcomm is expected to push for a 3nm process with the next Qualcomm Snapdragon 8 Gen 4 generation.

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TSMC’s 3nm SoCs to Debut in 2023, 2nm Chips Production to Begin 2025

Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its chips manufactured on 3nm fabrication process will be coming in 2023, and the ones made with 2nm process will debut in 2025. At the TSMC 2022 Technology Symposium, the chipmaker also announced a new technology, FinFlex, that it will use to make the N3 and N3E chipsets. The technology is said to provide manufacturers the versatility to offer high performance, lower power consumption, and maximum transistor density based on three-fin configuration options.

As per the announcement made at the symposium, the chipsets made by N3 technology, or 3nm manufacturing process, will go into volume production later in 2022. The 3nm node will debut in five tiers: N3, N3E (Enhanced), N3P (Performance Enhanced), N3S (Density Enhanced), and N3X (Ultra High Performance). The N3 chips will use FinFlex architectural technology and will be offered in three configuration options: 3-2 fin, 2-2 fin, and 2-1 fin.

N3 performance and power efficiency configuration comparison with N5
Photo Credit: TSMC

“Before TSMC N3 and FinFlex, chip designers often had to make difficult choices between speed, power consumption, and chip density,” the company said. The new methodology is said to “enable full optimisation of the N3 design library” resulting in high performance, efficient computing, and maximising transistor density.

The 3-2 fin configuration is for those who want highest performance, the 2-2 fin configuration offers a balance between performance, power efficiency, and density. Lastly, the 2-1 fin configuration is for those who want great power efficiency and highest density.

Coming to N2 technology; the chipsets manufactured by the 2nm fabrication process are scheduled to go into production in 2025. These SoCs will be even more powerful and efficient than the 3nm ones. As per the TSMC, 2nm chips will offer 10-15 percent speed improvement at the same power, or 25-30 percent power reduction at the same speed. The technology will feature nanosheet transistor architecture “to deliver a full-node improvement in performance and power efficiency.” N2 is scheduled to begin production in 2025.

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